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Solder paste printing is widely recognized as the most critical step in the surface mount technology (SMT) assembly process. Research consistently shows that approximately 50-70% of all SMT assembly defects originate from the solder paste printing ...
https://www.low-volume-pcb-assembly.com/news/the-science-of-solder-paste-printing-keys-to-perfect-smt-assembly/
Solder paste inspection, commonly abbreviated as SPI, is one of the most impactful inline quality control technologies in the modern SMT assembly line. Positioned immediately after the paste printing step and before component placement, SPI catches...
https://www.low-volume-pcb-assembly.com/news/the-role-of-spi-solder-paste-inspection-in-reducing-smt-defects/